Stock No.

NW2001-08-801

CAS

7440-50-8

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Purity

99.9 %

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Dimension

500mm X 500mm

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Thickness

4mm

PPI

50

Porosity

>70%

Molecular Formula

Cu

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Molecular Weight

63.55g/mol.

Density

8.96g/cm3

Melting Point

1085°C

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Boiling Point

2562°C

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Thermal Expansion

16.5µm./mk

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Thermal Conductivity

401W,/mk

Tensile Strength

1.25N/mm

Young's Modulus

110-128GPa

Shear Strength

190Psi 

Vickers hardness               

369MPa

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Electrical resistivity 

1.673µ©-cm

Poisson’s ratio 

0.34 

Specific heat 

0.39kj/kgK

Heat of fusion

13.26kJ.mol-1

Heat of vaporization 

300.4kJ.mol-1

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Manager QC

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