Gold Tin Solder Paste
(AuSn, Purity: 99.9%)
Product | Gold Tin Solder Paste | |
|---|---|---|
Stock No. | NW2001- | |
CAS | 7440-57-5/7440-31-5 | Confirm |
Purity | 99.9% | Confirm |
APS | 80-100nm | Confirm |
Shape | Spherical | Confirm |
Melting Point | Sn20/Au80 = 280°C, Sn25/Au75 = 280°C | Confirm |
Composition | Sn20/Au80 | |
density | Sn20/Au80 = 7.4 g/cc, Sn25/Au75 = 7.4 g/cc | Confirm |
Viscosity Range | 130 ± 40 Pas, Physica CSS 10 s-1 | |
Typical Print Thickness | 0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns | Confirm |
Main Inspect Verifier | QC In charge | Confirm |
