Tin Silver Solder Paste
(AuSn, Purity: 99.9%)
NanowizTech Tin Silver Solder Paste is a premium, high-performance soldering solution designed for professional electronics manufacturing, PCB assembly, and industrial applications. Trusted by engineers and technicians worldwide, this solder paste delivers precision, reliability, and consistent performance in both small-scale and large-volume production environments.
Solder paste is a critical material in modern electronics assembly. It combines metal alloy powders with flux to create a material that can efficiently bond components to printed circuit boards (PCBs). NanowizTech Tin Silver Solder Paste stands out due to its high-quality tin-silver composition, lead-free formulation, and superior thermal properties.
This solder paste is engineered to meet the most stringent requirements of surface-mount technology (SMT), through-hole assembly, and other industrial soldering applications.
Product | Tin Silver Solder Paste | |
|---|---|---|
Stock No. | NW2001-11-917 | |
CAS | 7440-22-4/7440-31-5 | Confirm |
Purity | 99.9% | Confirm |
APS | 80-100nm | Confirm |
Shape | Spherical | Confirm |
Melting Point | Sn80/Ag20 = 280°C, Sn25/ag75 = 280°C | Confirm |
Composition | Sn80/Ag20 | |
density | Sn80/Au20 = 7.4 g/cc, Sn25/Ag75 | Confirm |
Viscosity Range | 130 ± 40 Pas, Physica CSS 10 s-1 | |
Typical Print Thickness | 0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns | Confirm |
Main Inspect Verifier | QC In charge | Confirm |
Note: Product Specification are subject to amendment and may change over time.
NanowizTech Tin Silver Solder Paste: Comprehensive Guide for Electronics Manufacturing:
NanowizTech Tin Silver Solder Paste is a premium, high-performance soldering solution designed for professional electronics manufacturing, PCB assembly, and industrial applications. Trusted by engineers and technicians worldwide, this solder paste delivers precision, reliability, and consistent performance in both small-scale and large-volume production environments. Solder paste is a critical material in modern electronics assembly. It combines metal alloy powders with flux to create a material that can efficiently bond components to printed circuit boards (PCBs). NanowizTech Tin Silver Solder Paste stands out due to its high-quality tin-silver composition, lead-free formulation, and superior thermal properties. This solder paste is engineered to meet the most stringent requirements of surface-mount technology (SMT), through-hole assembly, and other industrial soldering applications.
Key Properties and Advantages
NanowizTech Tin Silver Solder Paste is designed with properties that optimize electronics assembly, reduce defects, and improve manufacturing efficiency.
Lead-Free & Environmentally Compliant
With global regulations like RoHS and WEEE, lead-free solder paste is essential. NanowizTech offers a 100% lead-free tin-silver formulation that ensures safety and sustainability while delivering excellent electrical and mechanical properties.
Excellent Wetting and Flow
One of the key features of high-quality solder paste is wetting ability. NanowizTech Tin Silver Solder Paste provides:
- Smooth and consistent flow on PCB pads
- Reduced solder ball formation
- Minimized bridging between fine-pitch components
This ensures high-quality solder joints, even in complex assemblies.
Thermal Stability
NanowizTech solder paste maintains performance under varying reflow profiles. This makes it compatible with:
- Lead-free reflow soldering
- Multi-layer PCB assembly
- Sensitive component soldering
Its thermal stability ensures minimal oxidation and reduces the risk of joint defects.
Fine-Pitch & High-Density Capability
Modern electronics often involve ultra-fine pitch components and high-density PCB layouts. NanowizTech Tin Silver Solder Paste supports:
- Type 4–5 powders for fine-pitch components
- Precise deposition with stencil printing
- Smooth soldering of QFP, BGA, and CSP packages
This property is critical for smartphones, IoT devices, and advanced electronics.
Applications of NanowizTech Tin Silver Solder Paste:
NanowizTech Tin Silver Solder Paste is versatile and used across multiple industries.
PCB Assembly
- Surface-Mount Technology (SMT)
- Through-Hole Component Soldering
- Mixed-Technology Boards
Electronics Manufacturing
- Consumer electronics: Smartphones, tablets, laptops
- Industrial electronics: Controllers, sensors, automation systems
- Automotive electronics: ECUs, sensors, infotainment systems
Prototype and High-Volume Production
NanowizTech solder paste is suitable for both low-volume prototypes and high-volume industrial production, maintaining consistent soldering performance across projects.
